Technologies we use to build
A stack your product
can live with.
Every layer below is chosen for availability, documentation quality and long-term support — not simply for what is newest.
EDA & simulation Schematic capture, SPICE, design review
We capture and simulate the circuit before committing to layout, so marginal operating points are found on the model rather than on the bench.
- Schematic capture
- SPICE & corner simulation
- ERC / DRC review
PCB & signal integrity Stack-up, impedance, SI/PI
Layer stack-ups, controlled impedance, return paths and power distribution are planned as part of the design, not corrected at pre-compliance.
- Multilayer layout
- Controlled impedance
- Thermal & DFM review
MCUs & SoCs 8/16/32-bit, ARM, RISC-V
Processing is picked around real constraints: peripherals, analog blocks, supply options, tooling and what stays available for the life of the product.
- ARM Cortex-M
- RISC-V
- 8/16/32-bit MCUs
RTOS & timing Deterministic control loops
Where timing matters more than flexibility, a real-time OS with measured worst-case latency beats a general-purpose stack.
- FreeRTOS
- Zephyr
- Timer & PWM design
Embedded Linux BSPs, kernel, distributions
Long-life connected products run on a maintained board support package and a kernel we know how to update, not a vendor image nobody can patch.
- BSP bring-up
- Kernel & device tree
- Custom distributions
Wireless & RF Short and long range links
Radio choice is a power, antenna, regulatory and lifecycle decision. We design the link budget, not just the module.
- Wi-Fi & BLE
- LoRa & Zigbee
- NB-IoT / cellular
Industrial buses Wired field connectivity
Plant and vehicle networks bring their own electrical realities — transients, termination and grounding — handled in the hardware.
- CAN & LIN
- RS-485 / Modbus
- USB & UART
Power electronics Conversion, protection, derating
Power design sets the limits of everything else: efficiency, thermal headroom, inrush behaviour and how the product behaves when the input is not ideal.
- SMPS & linear stages
- Protection & filtering
- Thermal derating
Test & compliance Evidence, not assumptions
Test points, instrumentation and documentation are planned with the design so results can be reproduced by your manufacturing partner.
- Bring-up & functional test
- Environmental testing
- EMC pre-scan